Budiana, Budiana and Aryeni, Illa and Maulidiah, Hana and Arrahim, Galih and Arifin, Muhammad (2024) Study Of Decapsulation On IC With Temperature And Volume H2SO4 Variation. In: Proceedings of the 6th International Conference on Applied Engineering, ICAE 2023, 7 November 2023, Batam, Riau islands, Indonesia.
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Abstract
Decapsulation is the process of opening the polymer layer covering the die. The purpose of decapsulation on IC is to facilitate checks on the quality of the die. The method carried out in this study uses the method of dripping H2SO4 on the IC surface. The variables to be examined in this study are v
| Item Type: | Conference or Workshop Item (UNSPECIFIED) |
|---|---|
| Date Deposited: | 04 Mar 2026 17:04 |
| Last Modified: | 17 Apr 2026 01:04 |
| URI: | http://eprints.eai.eu/id/eprint/46683 |
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