Kelana, Afandi and Nakul, Fitriyanti (2023) Staging Time Evaluation of Transfer Molding to PMC Process Towards Delamination on IC Package. In: Proceedings of the 5th International Conference on Applied Engineering, ICAE 2022, 5 October 2022, Batam, Indonesia.
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Abstract
Moisture-induced delamination is one of the reliability concerns in electronic packaging. This work evaluates moisture absorption changes by the staging time approach during the transfer molding to the post molding curing (PMC) process and the impact of moisture changes on the delamination of the in
| Item Type: | Conference or Workshop Item (UNSPECIFIED) |
|---|---|
| Date Deposited: | 04 Mar 2026 16:26 |
| Last Modified: | 17 Apr 2026 02:46 |
| URI: | http://eprints.eai.eu/id/eprint/43783 |
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